111 Haynes Court
  NY 11779
  Phone: 631-981-0900
  Fax: 631-981-1792

Build to Print Capabilities

Integrated Microwave Assemblies (IMA’s)

Rodelco has worked with several OEM customers in developing the capability for Build to Print of Integrated Microwave Assemblies.  Our BTP expertise is focused on IMA’s which require Engineering Expertise for testing/troubleshooting that far exceeds the capabilities of most BTP houses.


Rodelco can provide in-house capabilities for Assembly of both surface mount and chip & wire hybrid assemblies.  Rodelco’s test capabilities include full ATE through 50 GHz.


Rodelco’s main value in BTP is to provide fully screened and tested finished products to our customers with a minimum of technical support required.


FET Amplifier Amplifiers Amplifiers