Integrated Microwave Assemblies (IMA’s)

Rodelco has worked with several OEM customers in developing the capability for Build to Print of Integrated Microwave Assemblies.  Our BTP expertise is focused on IMA’s which require Engineering Expertise for testing/troubleshooting that far exceeds the capabilities of most BTP houses.

Rodelco can provide in-house capabilities for Assembly of both surface mount and chip & wire hybrid assemblies.  Rodelco’s test capabilities include full ATE through 50 GHz.

Rodelco’s main value in BTP is to provide fully screened and tested finished products to our customers with a minimum of technical support required.

Our concept of FLEXIBLE MICROWAVE SOLUTIONS allows our customers to participate in the design process and to insure that the mission requirements are met.


Please contact us at Rodelco Sales for your specific requirements.